Esec die bonder 2100xp machine in atk qualification plan

Objective: freescale pn / part name: customer name / pn: plan-results revision #/date: rev 1.2 / 05 nov 2012 / final results - 30 jan 2013 technology &

X becomes z the high- peed solution on die bonder 2100

Achieving die bonding quality at unreached throughput on esec's die bonder 2100 as one of the leaders in die attach for more than two decades, esec is committed

Die bonder 2007 ssi plus

Highest quality power semiconductor packaging the best in class soft solder die bonder 2007 ssiplus is oerlikon esec's answer to customers' ever increasing

Die bonder 2100 xp

A giant step in throughput and yield as one of the leaders in die attach for more than two decades, oerlikon esec is committed to surpassing its customers'

Die bonder 2008 hs plus

Oerlikon esec developed the ultimate epoxy die bonder with regards to hand-ling metal lead frames, substrates, thin die, stacked die and wafer backside

Fico fsl the new era in singulation

Esec die bonder 2100 fc is still bonding at full speed, ensuring high yield even if the operators have no time (or not enough skill) to detect misplaced die.

Implementation of on-bonder-curing to maximize array package ...

Parts were assembled on an esec 2007 die bonder retrofitted with a cure on bonder heater block assembly and cured at 160°c for 18 seconds. in

Fico fsl - get ready for the new era

Die bonder 2100 platform, esec replaces ink dots by e-dots complying to e142 standards 04integrated singula-tion solution fico // fico launches its new

1 automated optical inspection (aoi) 3 mvp 1820 ultra ...

24 pnp flip chip die bonder 2 esec micron 2 2002 25 refrigerated cabinet 1 harris-puffer hubbard iuf4025 26 refrigerated cabinet/freezer 1 revco ult 790-7-a14

Die attach film application in multi die stack package

Die attach film application in multi die stack package... die attach process optimization and redesign of die pick up collet and die bonder process block. 1.

International directory of die and flip chip bonders finetech gmbh & co. kg wolfener strasse 32-34 berlin 12681, germany tel: +49-30-936-6810 die bonder specifications flip chip bonder

Multichip die bonder 2200 evo the future of advanced packaging ...

Multichip die bonder 2200 evo the future of advanced packaging available today. innovative solution for innovative... esec (singapore) pte. ltd. 1, science park road

Dovebid worldwide amsterdam dovebid webcast auction atlanta

Esec model 2007 die bonder shinkawa model utc-2-00bi wire bonder sti model tri8as2 tape and reel machine. global provider of capital asset auction &...

Chip scale package (csp) wire bonding capability study

Good die (kgd), to handle... machine: esec 3008 gold wire bonder with 100khz transducer sw release version 53.0 package: test chip with al 1%si 0.5%

Ultrasonic friction power during al wire wedge-wedge bonding

The test chip is die bonded to a 20-pin... air ball fab on an esec 3100 automatic ball-wedge bonder. this bonder offers a software feature that allows to

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Die attach %clipse) ndustries,,#... bonder _!pril `!utomatic datacon at... esec com i 0eter"uehlmann peter buehlmann esec com c %3%#53! )nc 7 $rivers7ay

Product / process change notice - nu horizons electronics ...

Die attach esec 2007/2007hs (+) fully auto die bonder wire bond esec 3008/3088/3088ip fully auto wire bonder single well/giant/conventional mold...

Annual report 2011

Report of the supervisory board 35 corporate governance 38 financial statements 2011 45 consolidated statement of financial position 46 consolidated statement of...

Annual report 2010

Annual report 2010 besi annual report 2010 innovation is our tradition besi is a leading supplier of semiconductor assembly equipment for...

Feature stories - flip chip & wafer bumping interview ...

Both datacon and esec flip chip solutions. yd:... thin die appears to be a generic trend... the small gap between chip and bonder. to overcome this road block...

Group update

As well as die attach to fully support the 300mm... esec/ kns wire bonder, fico vacuum molding system, dis-co-hanmi package saw/pick and place system, and

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Esec model 2005 eutectic die bonder f & k delvotec model 6110 wire bonder t o view a complete asset list, visit www. dovebid. com laser markers • bonders...

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Flip chip markets-4page - welcome to techsearch international, inc.

Other driven by form factor where die sizes are small... 6.1.1 bump pitch drives bonder selection accuracy... esec, fuji machine, hitachi tokyo

August 7, 2007 the - microbonds x-wire™ bonding wire ...

Tioned that esec was available... share of the $520 million die bonder market in cy2005. alphasem generated sales of about $60 million in cy2005 for

Wykład z przedmiotu "montaż elektroniczny i systemy testujące"

Oerlikon esec semiconductor:... ultrasonic ball-wedge bonder for thin (25 um)... to being lowered onto the die bond area. if this condition is not

Semiconductor manufacturing equipment - global ...

860 eutectic die bonder. disco dad-321 dicing saw. disco dfd s/8 dual-spindle dicingsaw... esec 3018 wire bonders. eo technics csm 2000 laser wafermarker.

Brief introduction of sigurd ic package assembly

Die bond esec / asm / panasonic accuracy: +/- 25um... die bonder wire bonder grinding die sawer. 17 mold system pmc ovens smt line singulation saw. 18...

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